<img src="http://b.scorecardresearch.com/p?c1=2&c2=6035313&cv=2.0&cj=1" />

Technology for everyone should be made by everyone.

About Intel

Creating and extending computing technology to connect and enrich the lives of every person on Earth--that's our vision, is it yours? We are changing the world at Intel. Through our technical innovation, our endless efforts in education, environmental sustainability, healthcare, and much, much more.

The range of computing products based on Intel® architecture goes beyond PCs and servers and extends to phones, tablets, consumer electronics devices, and more.

Intel's Cellular and Devices group ( iCDG) is growing in India. The Modem R&D organization within iCDG creates leading edge slim modem and integrated SOC modem platforms. We are rapidly growing our capability in Bangalore to define, implement and validate modem platforms for 2G, 3G and LTE systems.

Towards this end we are looking for

  • Wireless System Engineers with PHY layer algorithm and performance modeling experience
  • Firmware and System Architects for the PHY layer
  • Firmware/Embedded systems and DSP Engineers with experience in PHY layer implementation
  • Component and System level Modem (PHY) Verification Engineers
  • Design Engineers with SystemC and modem architecture experience to build Pre-Silicon Virtual Prototype systems for modem platforms

The ideal candidate will have a B.Tech/M.Tech/Ph.D in Electrical/Computer Engineering or Computer Science with 2-20 years of relevant experience in the areas mentioned above.

Req Number Requisition Posting Title  
785365 3G DSP Firmware Development
Apply Now
785366 3G Control Firmware Development
Apply Now
785370 3G Firmware Component Verification – Post Silicon
Apply Now
779855 3G DSP FW Architect
Apply Now
780421 Team Lead – 3G/HSPA System Engineering
Apply Now
782240 Virtual Prototype/ Pre-Si Development Engineer
Apply Now
774274 Virtual Prototype Technical Lead
Apply Now
 

Life at Intel Facebook LinkedIn LinkedIn YouTube